Conector 09 vias femea 509009HA - 7.5/5.0mm

Alojamento femea 09 vias passo 7.5/5.0mm 509009HA Excon 8655-9 Molex Terminal compativel 5090TC051 Excon UL Approval: E237407 Section.7 Type: Wafer Pitch: 7.5-5.0 mm (0.295-0.197°) Contact Type: Wire to Board Series: 5090 Current rating: 9A AC / DC Voltang rating: 250V AC / DC Withstand voltage: 1000V AC / minute Insulation resistance: 1000M O min Contact resistance: 10m O max Temperature range -40° to + 105° (including temperature rise) Applicable PC board thickness 1.0 ~ 1.6 mm (0.039º to 0.063º) Circuits: 01 – 15P Material: Nylon 66 UL 94V-0